Almec’s surface mount (SMT) assembly service features the very latest in Auto Placement Machines. This includes intelligent/fast changeover feeders that can be re-loaded without stopping assembly. The machine knows the value and location of each component and exactly how many components remain on reach reel. We are able to place component packages including fine pitch, BGA's, chip scale BGA’s, CSP's, flip chips and sizes down to 0201. Our equipment is able to place complex surface mount component packages, such as QFP's as large as 50mm.

To complement the efficiency of the placement equipment, Almec uses high performance forced convection reflow oven technology capable of providing the high temperatures required for lead-free surface mount soldering. Our production facility continues to offer leaded surface mount assembly for those applications that still require it.

Almec offer a full procurement service, taking advantage of our buying power with the major suppliers of electronic components.